JPH0354467B2 - - Google Patents
Info
- Publication number
- JPH0354467B2 JPH0354467B2 JP11909083A JP11909083A JPH0354467B2 JP H0354467 B2 JPH0354467 B2 JP H0354467B2 JP 11909083 A JP11909083 A JP 11909083A JP 11909083 A JP11909083 A JP 11909083A JP H0354467 B2 JPH0354467 B2 JP H0354467B2
- Authority
- JP
- Japan
- Prior art keywords
- tray
- chip
- magazine
- chips
- trays
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000001125 extrusion Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11909083A JPS6010747A (ja) | 1983-06-30 | 1983-06-30 | 自動チツプ付装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11909083A JPS6010747A (ja) | 1983-06-30 | 1983-06-30 | 自動チツプ付装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6010747A JPS6010747A (ja) | 1985-01-19 |
| JPH0354467B2 true JPH0354467B2 (en]) | 1991-08-20 |
Family
ID=14752642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11909083A Granted JPS6010747A (ja) | 1983-06-30 | 1983-06-30 | 自動チツプ付装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6010747A (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6305500B1 (en) * | 1999-08-25 | 2001-10-23 | Maxtor Corporation | Material delivery system for clean room-like environments |
| KR100365543B1 (ko) * | 2000-08-30 | 2002-12-26 | 동양반도체장비 주식회사 | 반도체패키지 제조 장비의 엘리베이터 장치 |
| JP2010208647A (ja) * | 2009-03-09 | 2010-09-24 | Honda Motor Co Ltd | 物品収納トレー及び物品収納トレーの搬送方法 |
-
1983
- 1983-06-30 JP JP11909083A patent/JPS6010747A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6010747A (ja) | 1985-01-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6722840B2 (en) | Wafer ring supplying and returning apparatus | |
| JPS63211645A (ja) | ウエハーを装着及び離脱する方法及び装置 | |
| US20060113595A1 (en) | Rectangular substrate dividing apparatus | |
| CN210652040U (zh) | 自动上下料机 | |
| JPS58191494A (ja) | 部品の載置方法および装置 | |
| EP0655884B1 (en) | Transport-by-suction type die | |
| US20020192059A1 (en) | Methods and apparatus for transferring electrical components | |
| JPH0354467B2 (en]) | ||
| JPS6242380B2 (en]) | ||
| JPH0997996A (ja) | チップの実装装置 | |
| JP2555982B2 (ja) | 半導体装置の移載装置 | |
| JP2946845B2 (ja) | 電子部品実装装置のノズル交換装置 | |
| JPH10284888A (ja) | 電子部品実装装置および電子部品実装方法 | |
| JP4022154B2 (ja) | ダイボンディング装置 | |
| JPH06135504A (ja) | チップ供給装置 | |
| JPH0543184B2 (en]) | ||
| JP3954250B2 (ja) | 部品装着方法 | |
| JPH0221445Y2 (en]) | ||
| CN218996661U (zh) | 一种全自动半导体晶片种植贴膜一体机 | |
| CN217866740U (zh) | 一种双向错位不停机的ccd换料机构 | |
| JP3522131B2 (ja) | 産業ロボット装置 | |
| JPS6243542B2 (en]) | ||
| JPS6410935B2 (en]) | ||
| JPH0550130B2 (en]) | ||
| JPH0369200B2 (en]) |